METHOD OF FORMING FILM AND FILM FORMING APPARATUS

Details for Australian Patent Application No. 2003281012 (hide)

Owner TOKYO ELECTRON LIMITED

Inventors KAWANO, Yumiko; YAMASAKI, Hideaki; TADA, Yoshihide; ARIMA, Susumu; MATSUZAWA, Koumei; NAKAMURA, Kazuhito

Pub. Number AU-A-2003281012

PCT Number PCT/JP2003/0088

PCT Pub. Number WO2004/008516

Priority 2002-201535 10.07.02 JP

Filing date 10 July 2003

Wipo publication date 2 February 2004

International Classifications

H01L 021/31 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 016/452 Chemical deposition or plating by decomposition

H01L 021/316 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 016/18 Chemical deposition or plating by decomposition - from metallo-organic compounds

Event Publications

4 March 2004 Complete Application Filed

  Priority application(s): 2002-201535 10.07.02 JP

18 March 2004 Application Open to Public Inspection

  Published as AU-A-2003281012

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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