Manufacturing apparatus for depositing a material on an electrode for use therein

Details for Australian Patent Application No. 2009236678 (hide)

Owner Hemlock Semiconductor Corporation

Inventors Hillabrand, David; Knapp, Theodore

Agent Fisher Adams Kelly

Pub. Number AU-A-2009236678

PCT Pub. Number WO2009/128887

Priority 61/044,703 14.04.08 US

Filing date 13 April 2009

Wipo publication date 22 October 2009

International Classifications

H05B 3/03 (2006.01) Ohmic-resistance heating

C01B 33/035 (2006.01) Silicon

C23C 16/44 (2006.01) Chemical deposition or plating by decomposition - characterised by the method of coating

Event Publications

4 November 2010 PCT application entered the National Phase

  PCT publication WO2009/128887 Priority application(s): WO2009/128887

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