Manufacturing apparatus for depositing a material and an electrode for use therein

Details for Australian Patent Application No. 2009236677 (hide)

Owner Hemlock Semiconductor Corporation

Inventors Molnar, Michael; McCoy, Keith; Knapp, Theodore; Hillabrand, David; Dehtiar, Max

Agent Fisher Adams Kelly

Pub. Number AU-A-2009236677

PCT Pub. Number WO2009/128886

Priority 61/044,666 14.04.08 US

Filing date 13 April 2009

Wipo publication date 22 October 2009

International Classifications

F28F 13/18 (2006.01) Arrangements for modifying heat transfer, e.g. increasing, decreasing

C01B 33/035 (2006.01) Silicon

C23C 16/44 (2006.01) Chemical deposition or plating by decomposition - characterised by the method of coating

Event Publications

4 November 2010 PCT application entered the National Phase

  PCT publication WO2009/128886 Priority application(s): WO2009/128886

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