Method for packaging semiconductors at a wafer level

Details for Australian Patent Application No. 2008266190 (hide)

Owner Raytheon Company Hallock, R.

Inventors Kazior, Thomas E.; Zhang, Yiwen; Adlerstein, Michael G.; Trulli, Susan C.; Hallock, Robert B.

Agent Davies Collison Cave

Pub. Number AU-A-2008266190

PCT Pub. Number WO2008/157215

Priority 11/762,924 14.06.07 US

Filing date 12 June 2008

Wipo publication date 24 December 2008

International Classifications

H01L 23/10 (2006.01) Details of semiconductor or other solid state devices

Event Publications

24 December 2009 PCT application entered the National Phase

  PCT publication WO2008/157215 Priority application(s): WO2008/157215

25 March 2010 Alteration of Name

  The name of the applicant has been altered to Raytheon Company

5 April 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(a). A direction to request examination has been given for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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