Microwave integrated circuit package and method for forming such package
Details for Australian Patent Application No. 2008266189 (hide)
International Classifications
Event Publications
24 December 2009 PCT application entered the National Phase
PCT publication WO2008/157214 Priority application(s): WO2008/157214
11 March 2010 Alteration of Name
The name of the applicant has been altered to Raytheon Company
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2008266190-Method for packaging semiconductors at a wafer level
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