A method of molding a thermoplastic sheet

Details for Australian Patent Application No. 2004233537 (hide)

Owner Silverbrook Research Pty. Ltd.

Inventors Silverbrook, Kia

Agent Silverbrook Research Pty. Ltd.

Pub. Number AU-A-2004233537

Parent 2004202254

Filing date 1 December 2004

Wipo publication date 16 December 2004

Acceptance publication date 24 November 2005

International Classifications

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

Event Publications

16 December 2004 Application Open to Public Inspection

  Published as AU-A-2004233537

16 December 2004 Complete Application Filed

24 November 2005 Application Accepted

  Published as AU-A-2004233537

23 March 2006 Standard Patent Sealed

2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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