Wafer scale molding of protective caps

Details for Australian Patent Application No. 2004202254 (hide)

Owner Silverbrook Research Pty Ltd

Inventors Silverbrook, Kia

Agent Silverbrook Research Pty Ltd

Pub. Number AU-B-2004202254

Parent 2002218867

Filing date 26 May 2004

Wipo publication date 17 June 2004

Acceptance publication date 30 September 2004

International Classifications

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

Event Publications

10 June 2004 Complete Application Filed

17 June 2004 Application Open to Public Inspection

  Published as AU-B-2004202254

30 September 2004 Application Accepted

  Published as AU-B-2004202254

3 February 2005 Standard Patent Sealed

2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2004202255-Peer-to-peer name resolution wire protocol and message format data structure for use therein

2004202253-An inkjet printer that includes a transverse binding mechanism