A method of preparing a semiconductor chip having a protected microfabricated device

Details for Australian Patent Application No. 2004220750 (hide)

Owner Silverbrook Research Pty Ltd

Inventors Silverbrook, Kia

Agent Silverbrook Research Pty. Ltd.

Pub. Number AU-B-2004220750

Parent 2002216845

Filing date 18 October 2004

Wipo publication date 4 November 2004

Acceptance publication date 18 August 2005

International Classifications

H01L 021/822 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/04 Details of semiconductor or other solid state devices

Event Publications

4 November 2004 Application Open to Public Inspection

  Published as AU-B-2004220750

4 November 2004 Complete Application Filed

18 August 2005 Application Accepted

  Published as AU-B-2004220750

15 December 2005 Standard Patent Sealed

2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2004220751-A method of applying caps to microfabricated devices

2004220749-A method and system for facilitating a remote transaction