Wafer scale molding of protective caps

Details for Australian Patent Application No. 2002216845 (hide)

Owner Silverbrook Research Pty. Ltd.

Inventors Silverbrook, Kia

Agent Silverbrook Research Pty. Ltd.

Pub. Number AU-B-2002216845

PCT Pub. Number WO2002/056367

Priority PR 2448 10.01.01 AU

Filing date 8 January 2002

Wipo publication date 24 July 2002

Acceptance publication date 29 July 2004

International Classifications

H01L 021/822 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/04 Details of semiconductor or other solid state devices

Event Publications

6 February 2003 Application Open to Public Inspection

  Published as AU-B-2002216845

29 July 2004 Application Accepted

  Published as AU-B-2002216845

25 November 2004 Standard Patent Sealed

2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002216846-Molding of protective caps

2002216844-Perimeter security system and perimeter monitoring method