An integrated circuit assembly incorporating protective caps

Details for Australian Patent Application No. 2004214607 (hide)

Owner Silverbrook Research Pty. Ltd.

Inventors Silverbrook, Kia

Agent Silverbrook Research Pty. Ltd.

Pub. Number AU-B-2004214607

Parent 2004202251

Filing date 28 September 2004

Wipo publication date 14 October 2004

Acceptance publication date 3 November 2005

International Classifications

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

B29C 043/04 Compression moulding, i.e. applying external pressure to flow the moulding material - using movable moulds

Event Publications

14 October 2004 Application Open to Public Inspection

  Published as AU-B-2004214607

14 October 2004 Complete Application Filed

3 November 2005 Application Accepted

  Published as AU-B-2004214607

2 March 2006 Standard Patent Sealed

2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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