Wafer scale molding of protective caps

Details for Australian Patent Application No. 2004202251 (hide)

Owner Silverbrook Research Pty Ltd

Inventors Silverbrook, Kia

Agent Silverbrook Research Pty. Ltd.

Pub. Number AU-B-2004202251

Parent 2002218870

Filing date 26 May 2004

Wipo publication date 17 June 2004

Acceptance publication date 8 July 2004

International Classifications

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

B29C 043/04 Compression moulding, i.e. applying external pressure to flow the moulding material - using movable moulds

Event Publications

10 June 2004 Complete Application Filed

17 June 2004 Application Open to Public Inspection

  Published as AU-B-2004202251

8 July 2004 Application Accepted

  Published as AU-B-2004202251

4 November 2004 Standard Patent Sealed

2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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