Molding assembly for wafer scale molding of protective caps

Details for Australian Patent Application No. 2002218867 (hide)

International Classifications

Event Publications

6 February 2003 Application Open to Public Inspection

Published as AU-B-2002218867

11 March 2004 Application Accepted

Published as AU-B-2002218867

1 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under reg. 22.2I(2). This application has been accepted or advertised accepted. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

29 July 2004 Section 223 Application Allowed

Silverbrook Research Pty. Ltd. The time in which to pay the acceptance fee has been extended to 11 Jul 2004. Address for service in Australia - Silverbrook Research Pty. Ltd. 393 Darling Street Balmain NSW 2041

5 August 2004 Standard Patent Sealed

2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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