Molds for wafer scale molding of protective caps

Details for Australian Patent Application No. 2002218870 (hide)

International Classifications

Event Publications

6 February 2003 Application Open to Public Inspection

Published as AU-B-2002218870

4 March 2004 Application Accepted

Published as AU-B-2002218870

1 July 2004 Standard Patent Sealed

2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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