METHOD FOR INSPECTION, PROCESS FOR MAKING ANALYTIC PIECE, METHOD FOR ANALYSIS, ANALYZER, PROCESS FOR PRODUCING SOI WAFER, AND SOI WAFER

Details for Australian Patent Application No. 2003303886 (hide)

Owner SUMITOMO MITSUBISHI SILICON CORPORATION

Inventors OKUBO, Akira; KONDO, Hideyuki

Pub. Number AU-A-2003303886

PCT Number PCT/JP2003/0132

PCT Pub. Number WO2004/070828

Priority 2003-26540 03.02.03 JP

Filing date 16 October 2003

Wipo publication date 30 August 2004

International Classifications

H01L 021/66 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof - Testing or measuring during manufacture or treatment

H01L 021/265 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 027/12 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - the substrate being other than a semiconductor body, e.g. an insulating body

G01N 023/225 Investigating or analysing materials by the use of wave or particle radiation not covered by group or , e.g. X-rays, neutrons

Event Publications

23 September 2004 Complete Application Filed

  Priority application(s): 2003-26540 03.02.03 JP

30 September 2004 Application Open to Public Inspection

  Published as AU-A-2003303886

20 October 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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