METAL CORE SUBSTRATE PACKAGING

Details for Australian Patent Application No. 2003302851 (hide)

Owner INTEL CORPORATION

Inventors GUZEK, John; AZIMI, Hamid; WOOD, Dustin; MOBLEY, Washington

Pub. Number AU-A-2003302851

PCT Number PCT/US2003/0341

PCT Pub. Number WO2004/053983

Priority 10/313,932 05.12.02 US

Filing date 27 October 2003

Wipo publication date 30 June 2004

International Classifications

H01L 023/14 Details of semiconductor or other solid state devices

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/522 Details of semiconductor or other solid state devices

H05K 003/44 Apparatus or processes for manufacturing printed circuits - Manufacturing insulated metal core circuits

H05K 001/05 Printed circuits - Insulated metal substrate

Event Publications

29 July 2004 Complete Application Filed

  Priority application(s): 10/313,932 05.12.02 US

5 August 2004 Application Open to Public Inspection

  Published as AU-A-2003302851

22 September 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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