SEMICONDUCTOR DEVICE

Details for Australian Patent Application No. 2003292700 (hide)

Owner TOKYO ELECTRON LIMITED KONDOH, Eiichi

Inventors VEZIN, Vincent; KUREISHI, Yoshinori; KONDOH, Eiichi; OHTA, Tomohiro; KUBO, Kenichi

Pub. Number AU-A-2003292700

PCT Number PCT/JP2003/0169

PCT Pub. Number WO2004/081255

Priority 2003-17949 27.01.03 JP

Filing date 26 December 2003

Wipo publication date 30 September 2004

International Classifications

C25D 007/12 Electroplating characterised by the article coated - Semiconductors

C23C 018/18 Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating - Pretreatment of the material to be coated

H01L 021/288 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 018/04 Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating

Event Publications

22 April 2004 Complete Application Filed

  Priority application(s): 2003-17949 27.01.03 JP

4 November 2004 Application Open to Public Inspection

  Published as AU-A-2003292700

13 October 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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