HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION

Details for Australian Patent Application No. 2003281010 (hide)

Owner ASAHI KASEI KABUSHIKI KAISHA

Inventors KANATANI, Ryuichiro; KIMURA, Masashi; MARUYAMA, Kimiyuki

Pub. Number AU-A-2003281010

PCT Number PCT/JP2003/0087

PCT Pub. Number WO2004/008252

Priority 2002-202732 11.07.02 JP

Filing date 10 July 2003

Wipo publication date 2 February 2004

International Classifications

G03F 007/038 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Macromolecular compounds which are rendered insoluble or differentially wettable

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

G03F 007/004 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Photosensitive materials

C08G 073/06 Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups

Event Publications

4 March 2004 Complete Application Filed

  Priority application(s): 2002-202732 11.07.02 JP

18 March 2004 Application Open to Public Inspection

  Published as AU-A-2003281010

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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