METHOD FOR FORMING METALMETAL OXIDE ETCH STOP/ ELECTROMIGRATION BARRIER FOR INTEGRATED CIRCUIT INTERCONNECTS AND DEVICE

Details for Australian Patent Application No. 2003272411 (hide)

Owner INTEL CORPORATION (a Delawware Corporation)

Inventors MORROW, Xiaorong; LEU, Jihperng; KUHN, Markus; MIAZ, Jose

Pub. Number AU-A-2003272411

PCT Number PCT/US03/28925

PCT Pub. Number WO2004/030088

Priority 10/255,930 25.09.02 US

Filing date 12 September 2003

Wipo publication date 19 April 2004

International Classifications

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/532 Details of semiconductor or other solid state devices

H01L 021/316 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

22 January 2004 Complete Application Filed

  Priority application(s): 10/255,930 25.09.02 US

20 May 2004 Application Open to Public Inspection

  Published as AU-A-2003272411

7 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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