PHOTOSENSITIVE RESIN COMPOSITION, AND, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND PRINTED WIRING BOARD USING THE COMPOSITION

Details for Australian Patent Application No. 2003271131 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors HAMA, Masayuki; HAMADA, Keishi; MAMIYA, Tsutomu; KATSURAHARA, Tooru; KAWAGUCHI, Kennichi; YOSHINO, Toshizumi; SATOU, Kuniaki; JOUMEN, Masayoshi

Pub. Number AU-A-2003271131

PCT Number PCT/JP03/12910

PCT Pub. Number WO2004/034147

Priority 2002/295287 08.10.02 JP

Filing date 8 October 2003

Wipo publication date 4 May 2004

International Classifications

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

G03F 007/032 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - with binders

G03F 007/035 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces

H05K 003/28 Apparatus or processes for manufacturing printed circuits - Applying non-metallic protective coatings

Event Publications

15 January 2004 Complete Application Filed

  Priority application(s): 2002/295287 08.10.02 JP

3 June 2004 Application Open to Public Inspection

  Published as AU-A-2003271131

30 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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