SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURED BY THE METHODS

Details for Australian Patent Application No. 2003235902 (hide)

Owner NEC CORPORATION

Inventors OGURA, Atsushi

Pub. Number AU-A-2003235902

PCT Number PCT/JP03/05783

PCT Pub. Number WO2003/096426

Priority 2002-133090 08.05.02 JP

Filing date 8 May 2003

Wipo publication date 11 November 2003

International Classifications

H01L 027/12 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - the substrate being other than a semiconductor body, e.g. an insulating body

H01L 021/265 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

4 September 2003 Complete Application Filed

  Priority application(s): 2002-133090 08.05.02 JP

15 January 2004 Application Open to Public Inspection

  Published as AU-A-2003235902

27 January 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

10 December 2009 Corrigenda

  Applications OPI - Name Index Under the name NEC CORPORATION, Application No. 2003235902, under INID (43) correct the publication date to read 24.11.2003

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