JOINTING METHOD FOR ELECTRONIC COMPONENTS, AND JOINTING DEVICE USED FOR THE METHOD

Details for Australian Patent Application No. 2003201895 (hide)

Owner FUJITSU LIMITED

Inventors KOBAE, Kenji; KAINUMA, Norio; KOBAYASHI, Hiroshi; TAKEUCHI, Shuichi; MATSUMURA, Takayoshi; KIRA, Hidehiko

Pub. Number AU-A-2003201895

PCT Number PCT/JP03/00293

PCT Pub. Number WO2004/064141

Filing date 15 January 2003

Wipo publication date 10 August 2004

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/607 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B23K 020/10 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating - making use of vibrations, e.g. ultrasonic welding

Event Publications

3 April 2003 Complete Application Filed

9 September 2004 Application Open to Public Inspection

  Published as AU-A-2003201895

13 October 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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