SUBSTRATE TREATING DEVICE AND SUBSTRATE TREATING METHOD, SUBSTRATE FLATTENING METHOD

Details for Australian Patent Application No. 2002346147 (hide)

Owner TOKYO ELECTRON LIMITED OHMI, Tadahiro

Inventors OHMI, Tadahiro; HIRAYAMA, Masaki; SUGAWA, Shigetoshi; GOTO, Tetsuya

Pub. Number AU-A-2002346147

PCT Number PCT/JP02/06737

PCT Pub. Number WO2003/005435

Priority 2001-205171 05.07.01 JP

Filing date 3 July 2002

Wipo publication date 21 January 2003

International Classifications

H01L 021/324 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

6 March 2003 Complete Application Filed

  Priority application(s): 2001-205171 05.07.01 JP

22 May 2003 Application Open to Public Inspection

  Published as AU-A-2002346147

18 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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