PHOTOSENSITIVE RESIN COMPOSITION, PROCESS OF FORMING PATTERNS WITH THE SAME, AND ELECTRONIC COMPONENTS

Details for Australian Patent Application No. 2002346145 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors NAGOYA, Tomohiro; MATSUURA, Hidekazu; SHIMIZU, Takehiro

Pub. Number AU-A-2002346145

PCT Number PCT/JP02/06733

PCT Pub. Number WO2003/005127

Priority 2001-202458 03.07.01 JP; 2001-202459 03.07.01 JP; 2002-085768 26.03.02 JP; 2002-085769 26.03.02 JP

Filing date 3 July 2002

Wipo publication date 21 January 2003

International Classifications

G03F 007/038 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Macromolecular compounds which are rendered insoluble or differentially wettable

G03F 007/075 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Silicon-containing compounds

C08G 073/14 Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups

C08G 069/06 Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule

Event Publications

6 March 2003 Complete Application Filed

  Priority application(s): 2001-202458 03.07.01 JP; 2001-202459 03.07.01 JP; 2002-085768 26.03.02 JP; 2002-085769 26.03.02 JP

22 May 2003 Application Open to Public Inspection

  Published as AU-A-2002346145

18 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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