THERMOSETTING ELECTROCONDUCTIVE PASTE FOR ELECTROCONDUCTIVE BUMP USE

Details for Australian Patent Application No. 2002331686 (hide)

Owner E. I. DU PONT DE NEMOURS AND COMPANY

Inventors KOJO, Hiroki; MATSUNO, Hisashi

Pub. Number AU-A-2002331686

PCT Number PCT/US02/26773

PCT Pub. Number WO2003/019998

Priority 60/314,688 24.08.01 US

Filing date 23 August 2002

Wipo publication date 10 March 2003

International Classifications

H05K 001/09 Printed circuits - Use of materials for the metallic pattern

H05K 003/40 Apparatus or processes for manufacturing printed circuits - Forming printed elements for providing electric connections to or between printed circuits

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H01B 001/22 Conductors or conductive bodies characterised by the conductive materials - the conductive material comprising metals or alloys

Event Publications

6 February 2003 Complete Application Filed

  Priority application(s): 60/314,688 24.08.01 US

5 June 2003 Application Open to Public Inspection

  Published as AU-A-2002331686

10 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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