INTEGRATED CIRCUIT HAVING INTERCONNECT TO A SUBSTRATE AND METHOD THEREFOR

Details for Australian Patent Application No. 2002327714 (hide)

Owner MOTOROLA, INC.

Inventors REBER, Douglas, M.

Pub. Number AU-A-2002327714

PCT Number PCT/US02/30337

PCT Pub. Number WO2003/036702

Priority 09/986,232 22.10.01 US

Filing date 27 September 2002

Wipo publication date 6 May 2003

International Classifications

H01L 021/285 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

23 January 2003 Complete Application Filed

  Priority application(s): 09/986,232 22.10.01 US

3 July 2003 Application Open to Public Inspection

  Published as AU-A-2002327714

8 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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