EXTENSION OF FATIGUE LIFE FOR C4 SOLDER BALL IN A CHIP TO SUBSTRATE CONNECTION

Details for Australian Patent Application No. 2002321103 (hide)

Owner INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventors HOMA, Thomas, R.; JOHNSON, Eric, A.; LANGEVIN, Pierre; MEMIS, Irving; TRAN, Son, K.; WHITE, Robert, F.; BERNIER, William, E.; CAREY, Charles, E.; GRAMATZKI, Eberhard, B.

Pub. Number AU-A-2002321103

PCT Number PCT/EP02/06922

PCT Pub. Number WO2003/001585

Priority 09/885,853 20.06.01 US

Filing date 4 June 2002

Wipo publication date 8 January 2003

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H01L 023/485 Details of semiconductor or other solid state devices

Event Publications

16 January 2003 Complete Application Filed

  Priority application(s): 09/885,853 20.06.01 US

19 June 2003 Application Open to Public Inspection

  Published as AU-A-2002321103

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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