METHOD OF FORMING VIA METAL LAYER AND VIA METAL LAYERFORMED SUBSTRATE

Details for Australian Patent Application No. 2002313268 (hide)

Owner TOKYO ELECTRON LIMITED

Inventors YUASA, Mitsuhiro

Pub. Number AU-A-2002313268

PCT Number PCT/JP02/06436

PCT Pub. Number WO2003/007366

Priority 2001-207869 09.07.01 JP

Filing date 26 June 2002

Wipo publication date 29 January 2003

International Classifications

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 025/065 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

Event Publications

2 January 2003 Complete Application Filed

  Priority application(s): 2001-207869 09.07.01 JP

22 May 2003 Application Open to Public Inspection

  Published as AU-A-2002313268

8 April 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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