Accelerometer protected by caps applied at the wafer scale
Details for Australian Patent Application No. 2002218868 (hide)
International Classifications
Event Publications
6 February 2003 Application Open to Public Inspection
Published as AU-B-2002218868
3 February 2005 Application Accepted
Published as AU-B-2002218868
30 June 2005 Standard Patent Sealed
14 July 2005 Application for Amendment
The nature of the amendment is as shown in the statement(s) filed 06 Jun 2005. Address for service in Australia - Silverbrook Research Pty. Ltd. 393 Darling Street Balmain NSW 2041
10 November 2005 Amendment Made
The nature of the amendment is as shown in the statement(s) filed 06 Jun 2005
15 December 2005 Standard Patent Sealed
2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired
This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.
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Next and Previous Patents/Applications
2002218869-Inkjet device encapsulated at the wafer scale
2002218867-Molding assembly for wafer scale molding of protective caps
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