Multilayer sheet for encapsulation of electronic device and method for manufacturing electronic device using same

Details for Australian Patent Application No. 2010277042 (hide)

Owner Fujikura Ltd.

Inventors Doi, Katsuhiro; Okada, Kenichi; Usui, Hiroki

Agent FB Rice

Pub. Number AU-B-2010277042

PCT Pub. Number WO2011/013389

Priority 2009-175939 28.07.09 JP

Filing date 4 February 2010

Wipo publication date 3 February 2011

Acceptance publication date 5 July 2012

International Classifications

H01M 14/00 Electrochemical current or voltage generators not provided for in groups

C09J 7/02 Adhesives in the form of films or foils - on carriers

H01L 31/04 Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation - adapted as conversion devices

H01L 51/50 Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part - specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)

H01M 2/08 Constructional details, or processes of manufacture, of the non-active parts - Sealing materials

H05B 33/04 Electroluminescent light sources - Sealing arrangements

Event Publications

26 May 2011 PCT application entered the National Phase

  PCT publication WO2011/013389 Priority application(s): WO2011/013389

5 July 2012 Application Accepted

  Published as AU-B-2010277042

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