Composite Material, High-Frequency Circuit Substrate Made Therefrom and Making Method Thereof

Details for Australian Patent Application No. 2010200472 (hide)

Owner Guangdong Shengyi Sci.Tech Co., Ltd

Inventors Su, Min She

Agent Lesicar Perrin

Pub. Number AU-B-2010200472

Priority 200910189729.7 24.08.09 CN

Filing date 10 February 2010

Wipo publication date 10 March 2011

Acceptance publication date 3 November 2011

International Classifications

C08F 299/00 (2006.01) Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers

C08K 13/02 (2006.01) Use of mixtures of ingredients not covered by any single one of main groups , each of these compounds being essential

C08L 9/06 (2006.01) Compositions of homopolymers or copolymers of conjugated diene hydrocarbons

H05K 1/03 (2006.01) Printed circuits - Use of materials for the substrate

Event Publications

25 February 2010 Complete Application Filed

  Priority application(s): 200910189729.7 24.08.09 CN

10 March 2011 Application Open to Public Inspection

  Published as AU-B-2010200472

3 November 2011 Application Accepted

  Published as AU-B-2010200472

1 March 2012 Standard Patent Sealed

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