Method for fabricating 3D structure having hydrophobic surface by dipping method

Details for Australian Patent Application No. 2009224145 (hide)

Owner POSTECH ACADEMY-INDUSTRY FOUNDATION

Inventors Lee, Sang-Min; Lee, Kun-Hong; Lee, Byeong-Joo; Hwang, Woon-Bong; Park, Hyun-Chul; Kim, Joon-Won; Lim, Geun-Bae; Kim, Dong-Seob

Agent Griffith Hack

Pub. Number AU-A-2009224145

PCT Pub. Number WO2009/113824

Priority 10-2008-0024029 14.03.08 KR

Filing date 12 March 2009

Wipo publication date 17 September 2009

International Classifications

C23C 2/12 (2006.01) Coating by applying the coating material in the molten state

C25D 11/04 (2006.01) Electrolytic coating by surface reaction, i.e. forming conversion layers - of aluminium or alloys based thereon

C25F 3/02 (2006.01) Electrolytic etching or polishing

Event Publications

23 September 2010 PCT application entered the National Phase

  PCT publication WO2009/113824 Priority application(s): WO2009/113824

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