Electrical connection of a substrate within a vacuum device via electrically conductive epoxy/paste

Details for Australian Patent Application No. 2009200888 (hide)

Owner ITT Manufacturing Enterprises, Inc.

Inventors Brown, Benjamin

Agent Griffith Hack

Pub. Number AU-A-2009200888

Priority 12/170,562 10.07.08 US

Filing date 5 March 2009

Wipo publication date 28 January 2010

International Classifications

H01J 31/48 (2006.01) Cathode-ray tubes

H01J 31/49 (2006.01) Cathode-ray tubes

H01L 23/48 (2006.01) Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 31/02 (2006.01) Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation - Details

Event Publications

26 March 2009 Complete Application Filed

  Priority application(s): 12/170,562 10.07.08 US

28 January 2010 Application Open to Public Inspection

  Published as AU-A-2009200888

19 April 2012 Assignment before Grant

  ITT Manufacturing Enterprises, Inc. The application has been assigned to Exelis Inc.

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