Cu-Ni-Si-Co-base copper alloy for electronic material and process for producing the copper alloy

Details for Australian Patent Application No. 2008305239 (hide)

Owner Nippon Mining & Metals Co., Ltd.

Inventors Kuwagaki, Hiroshi; Era, Naohiko

Agent Pizzeys

Pub. Number AU-B-2008305239

PCT Pub. Number WO2009/041197

Priority 2007-254197 28.09.07 JP

Filing date 22 August 2008

Wipo publication date 2 April 2009

Acceptance publication date 22 April 2010

International Classifications

C22C 9/06 (2006.01) Alloys based on copper - with nickel or cobalt as the next major constituent

B21B 3/00 (2006.01) Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences

C22F 1/08 (2006.01) Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working - of copper or alloys based thereon

H01B 1/02 (2006.01) Conductors or conductive bodies characterised by the conductive materials -

H01B 13/00 (2006.01) Apparatus or processes specially adapted for manufacturing conductors or cables

H01L 23/50 (2006.01) Details of semiconductor or other solid state devices

C22F 1/00 (2006.01) Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Event Publications

4 June 2009 PCT application entered the National Phase

  PCT publication WO2009/041197 Priority application(s): WO2009/041197

22 April 2010 Application Accepted

  Published as AU-B-2008305239

19 August 2010 Standard Patent Sealed

21 April 2011 Alteration of Name

  The name of the patentee has been altered to JX Nippon Mining & Metals Corporation

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