Method in manufacturing of circuit boards

Details for Australian Patent Application No. 2008263848 (hide)

Owner Finnish Environment Technology Oy

Inventors Salminen, Antti; Holappa, Rauno

Agent Griffith Hack

Pub. Number AU-A-2008263848

PCT Pub. Number WO2008/152193

Priority 20070453 07.06.07 FI; 20070904 26.11.07 FI

Filing date 29 May 2008

Wipo publication date 18 December 2008

International Classifications

H05K 3/46 (2006.01) Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H05K 3/02 (2006.01) Apparatus or processes for manufacturing printed circuits - in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

H05K 3/10 (2006.01) Apparatus or processes for manufacturing printed circuits - in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Event Publications

14 January 2010 PCT application entered the National Phase

  PCT publication WO2008/152193 Priority application(s): WO2008/152193

18 November 2010 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(a). A direction to request examination has been given for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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