Dry etching apparatus and dry etching method

Details for Australian Patent Application No. 2008250190 (hide)

Owner Ulvac, Inc.

Inventors Hayashi, Toshio; Suu, Koukou; Morikawa, Yasuhiro

Agent Griffith Hack

Pub. Number AU-A-2008250190

PCT Pub. Number WO2008/140012

Priority 2007-126442 11.05.07 JP

Filing date 8 May 2008

Wipo publication date 20 November 2008

International Classifications

H01L 21/3065 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 4/10 (2006.01) Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge - Oxides, borides, carbides, nitrides, silicides or mixtures thereof

Event Publications

26 November 2009 PCT application entered the National Phase

  PCT publication WO2008/140012 Priority application(s): WO2008/140012

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