Measurement method of layer thickness for thin film stacks

Details for Australian Patent Application No. 2008243203 (hide)

Owner Hitachi, Ltd.

Inventors Yoneyama, Akio; Ueda, Kazuhiro

Agent Davies Collison Cave

Pub. Number AU-B-2008243203

Priority 007115/2008 16.01.08 JP

Filing date 11 November 2008

Wipo publication date 30 July 2009

Acceptance publication date 5 August 2010

International Classifications

G01B 15/02 (2006.01) Measuring arrangements characterised by the use of wave or particle radiation - for measuring thickness

G01N 23/00 (2006.01) Investigating or analysing materials by the use of wave or particle radiation not covered by group or , e.g. X-rays, neutrons

H01L 21/66 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof - Testing or measuring during manufacture or treatment

Event Publications

27 November 2008 Complete Application Filed

  Priority application(s): 007115/2008 16.01.08 JP

30 July 2009 Application Open to Public Inspection

  Published as AU-B-2008243203

5 August 2010 Application Accepted

  Published as AU-B-2008243203

2 December 2010 Standard Patent Sealed

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