Surface mountable integrated circuit packaging scheme

Details for Australian Patent Application No. 2008230024 (hide)

Owner SiBeam, Inc

Inventors Ali, Mohammed Ershad; Doan, Chinh Huy

Agent Davies Collison Cave

Pub. Number AU-A-2008230024

Filing date 20 October 2008

Wipo publication date 6 May 2010

International Classifications

H01L 21/82 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01Q 9/00 (2006.01) Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements

H05K 1/02 (2006.01) Printed circuits - Details

Event Publications

6 November 2008 Complete Application Filed

6 May 2010 Application Open to Public Inspection

  Published as AU-A-2008230024

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