Method for bonding a wire conductor laid on a substrate

Details for Australian Patent Application No. 2008221518 (hide)

Owner Aontec teoranta

Inventors O'Keeffe, Seamus; Morley, Brendan

Agent IP Gateway Patent and Trademark Attorneys

Pub. Number AU-A-2008221518

Priority EP 07018301.7 18.09.07 EP

Filing date 18 September 2008

Wipo publication date 2 April 2009

International Classifications

H01L 21/60 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

G06K 19/077 (2006.01) Record carriers for use with machines and with at least a part designed to carry digital markings - Constructional details, e.g. mounting of circuits in the carrier

H05K 3/00 (2006.01) Apparatus or processes for manufacturing printed circuits

Event Publications

9 October 2008 Complete Application Filed

  Priority application(s): EP 07018301.7 18.09.07 EP

2 April 2009 Application Open to Public Inspection

  Published as AU-A-2008221518

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