Process for copper electrodeposition in the microelectronics industry for submicron features and in the copper foil industry
Details for Australian Patent Application No. 2007900893 (hide)
Event Publications
8 March 2007 Provisional Application Filed
Legal
The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.
Next and Previous Patents/Applications
IP Reporting Samples
Customised IP Reporting
IP Insider for IP Professionals
IP Monitor Professional
- Editable Word format reports
- For IP Professionals
- Multiuser