High temperature, high voltage SiC void-less electronic package

Details for Australian Patent Application No. 2007307054 (hide)

Owner Microsemi Corporation

Inventors Kelly, Stephen G.; Autry, Tracy

Agent Callinan

Pub. Number AU-B-2007307054

PCT Pub. Number WO2008/045416

Priority 60/850,470 06.10.06 US

Filing date 9 October 2007

Wipo publication date 17 April 2008

Acceptance publication date 27 January 2011

International Classifications

H01L 23/433 (2006.01) Details of semiconductor or other solid state devices

H01L 23/373 (2006.01) Details of semiconductor or other solid state devices

H01L 25/07 (2006.01) Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

Event Publications

28 May 2009 PCT application entered the National Phase

  PCT publication WO2008/045416 Priority application(s): WO2008/045416

27 January 2011 Application Accepted

  Published as AU-B-2007307054

26 May 2011 Standard Patent Sealed

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