A SOFC stack having a high temperature bonded ceramic interconnect and method for making same
Details for Australian Patent Application No. 2007234833 (hide)
International Classifications
Event Publications
16 October 2008 PCT application entered the National Phase
PCT publication WO2007/118127 Priority application(s): WO2007/118127
25 March 2010 Application Accepted
Published as AU-B-2007234833
22 July 2010 Standard Patent Sealed
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