Moldboard positioning assembly and use thereof

Details for Australian Patent Application No. 2007231806 (hide)

Owner Lee, J.

Inventors Lee, Jen-Hsin

Agent Freehills

Pub. Number AU-A-2007231806

Priority 095141498 09.11.06 TW

Filing date 1 November 2007

Wipo publication date 29 May 2008

International Classifications

E04G 17/065 (2006.01) Connecting or other auxiliary members for forms, falsework structures, or shutterings

B28B 1/14 (2006.01) Producing shaped articles from the material - by simple casting, the material being neither forcibly fed nor positively compacted

B28B 7/02 (2006.01) Moulds - Moulds with adjustable parts

Event Publications

22 November 2007 Complete Application Filed

  Priority application(s): 095141498 09.11.06 TW

10 January 2008 Corrigenda

  Complete Applications Filed - Name Index Under the name Jen Hsin Lee, Application No. 2007231806, under INID (71) correct the name to read Jen-Hsin Lee

29 May 2008 Application Open to Public Inspection

  Published as AU-A-2007231806

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