An LED Packaging Process and Apparatus

Details for Australian Patent Application No. 2007214307 (hide)

Owner Lednium Technology Pty Limited

Inventors Jaganathan, Balu; Montagnat, John Albert

Agent Davies Collison Cave

Pub. Number AU-A-2007214307

Filing date 30 August 2007

Wipo publication date 11 October 2007

International Classifications

H01L 21/56 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

F21V 3/04 (2006.01) Globes

H01L 23/29 (2006.01) Details of semiconductor or other solid state devices

Event Publications

13 September 2007 Complete Application Filed

11 October 2007 Application Open to Public Inspection

  Published as AU-A-2007214307

27 September 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(a). A direction to request examination has been given for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2007214308-Method for dynamically adapting button size on touch screens to compensate for hand tremor

2007214306-Factor VII glycoforms