Method of reducing voids in dough

Details for Australian Patent Application No. 2007200389 (hide)

International Classifications

Event Publications

15 February 2007 Complete Application Filed

Priority application(s): 11/343,348 31.01.06 US

5 April 2007 Amendment Made

The nature of the amendment is: Amend the invention title to read Method of reducing voids in dough 2007200409 LG Electronics Inc The nature of the amendment is: Amend priority details from 10-2006-0085924 6 Sep 2006 KR to 10-2006-0098191 10 Oct 2006 KR 2007200635 Mitsubishi Denki Kabushiki Kaisha The nature of the amendment is as shown in the statement(s) filed 02 Mar 2007

16 August 2007 Application Open to Public Inspection

Published as AU-A-2007200389

23 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(d). Examination has been requested or an examination report has issued for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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