Magnetron sputtering apparatus

Details for Australian Patent Application No. 2006300441 (hide)

Owner Tohoku University Tokyo Electron Limited

Inventors Matsuoka, Takaaki; Ohmi, Tadahiro; Goto, Tetsuya

Agent Griffith Hack

Pub. Number AU-A-2006300441

PCT Pub. Number WO2007/043476

Priority 2005-295181 07.10.05 JP

Filing date 6 October 2006

Wipo publication date 19 April 2007

International Classifications

C23C 14/35 (2006.01) Coating by vacuum evaporation, by sputtering or by ion implantation - by application of a magnetic field, e.g. magnetron sputtering

Event Publications

29 May 2008 Amendment Made

  The nature of the amendment is as shown in the statement(s) filed 05 May 2008

29 May 2008 PCT application entered the National Phase

  PCT publication WO2007/043476 Priority application(s): WO2007/043476

4 August 2011 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(e). Examination has been requested or an examination report has issued for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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