Heat shrinkable film with (meth)acrylate resin curable adhesive

Details for Australian Patent Application No. 2006287537 (hide)

Owner Avery Dennison Corporation

Inventors Kaul, Payal; Williams Jr., Richard K.; Ghiam, Farid F.; Blackwell, Christopher J.; Rajan, Sunder R.; Harman, Patricia Ann; Amon, Moris

Agent Callinan

Pub. Number AU-B-2006287537

PCT Pub. Number WO2007/030583

Priority 60/715,689 09.09.05 US

Filing date 8 September 2006

Wipo publication date 15 March 2007

Acceptance publication date 20 October 2011

International Classifications

C09J 7/02 (2006.01) Adhesives in the form of films or foils - on carriers

G09F 3/10 (2006.01) Labels, tag tickets, or similar identification or indication means - by an adhesive layer

Event Publications

1 May 2008 Amendment Made

  The nature of the amendment is: Amend the name of the inventor to read Kaul, Payal; Williams Jr., Richard K.; Ghiam, Farid F.; Blackwell, Christopher J.; Rajan, Sunder R.; Harman, Patricia Ann and Amon, Moris

1 May 2008 PCT application entered the National Phase

  PCT publication WO2007/030583 Priority application(s): WO2007/030583

13 October 2011 Amendment Made

  The nature of the amendment is: Amend the name of the inventor to read Kaul, Payal; Williams Jr., Richard K.; Ghiam, Farid F.; Blackwell, Christopher J.; Rajan, Sunder R.; Harman, Patricia Ann and Amon, Moris

20 October 2011 Application Accepted

  Published as AU-B-2006287537

16 February 2012 Standard Patent Sealed

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