Heat sink packaging assembly for electronic components

Details for Australian Patent Application No. 2006284476 (hide)

Owner Motorola, Inc.

Inventors Anderson, George C.; Diaz, Jose

Agent Halford & Co

Pub. Number AU-A-2006284476

PCT Pub. Number WO2007/024355

Priority 11/213,200 25.08.05 US

Filing date 13 July 2006

Wipo publication date 1 March 2007

International Classifications

H01L 23/34 (2006.01) Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

Event Publications

6 March 2008 PCT application entered the National Phase

  PCT publication WO2007/024355 Priority application(s): WO2007/024355

3 March 2011 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(e). Examination has been requested or an examination report has issued for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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