Thermally conductive thermoplastics for die-level packaging of microelectronics

Details for Australian Patent Application No. 2006282935 (hide)

International Classifications

Event Publications

20 March 2008 PCT application entered the National Phase

PCT publication WO2007/025134 Priority application(s): WO2007/025134

14 April 2011 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(e). Examination has been requested or an examination report has issued for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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