A three-dimensional adhesive device having a microelectronic system embedded therein

Details for Australian Patent Application No. 2006222414 (hide)

International Classifications

Event Publications

20 September 2007 PCT application entered the National Phase

PCT publication WO2006/094513 Priority application(s): WO2006/094513

1 May 2008 Assignment before Grant

Coloplast A/S; Delta The application has been assigned to CutiSense A/S

3 March 2011 Application Accepted

Published as AU-B-2006222414

30 June 2011 Standard Patent Sealed

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