Method and arrangement for contactconnecting semiconductor chips on a metallic substrate

Details for Australian Patent Application No. 2006215267 (hide)

Owner Assa Abloy Identification Technology Group AB

Inventors Michalk, Manfred; Nieland, Sabine; Michalk, Martin

Agent Pizzeys

Pub. Number AU-A-2006215267

PCT Pub. Number WO2006/087686

Priority 10 2005 007 643.2 19.02.05 DE

Filing date 17 February 2006

Wipo publication date 24 August 2006

International Classifications

H01L 21/60 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

20 September 2007 PCT application entered the National Phase

  PCT publication WO2006/087686 Priority application(s): WO2006/087686

6 March 2008 Assignment before Grant

  Assa Abloy Identification Technology Group AB The application has been assigned to Assa Abloy AB

15 September 2011 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(d). Examination has been requested or an examination report has issued for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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